Production

 

Production Assembly, Assembly Production, Product Assembly CompanyRiverSide Electronics’ manufacturing facilities are modern, well equipped, well maintained, and are organized for minimal assembly handling. The production floor environment is humidity controlled, clean, bright, and spacious. Manufacturing is well staffed with skilled and dedicated Engineers, Technicians, and Assemblers who are trained to use IPC workmanship standards.

RiverSide specializes in high-mix, low- to medium-volume build of electronic and electromechanical assemblies – from prototype circuit boards through box build assemblies. Our Customers are able to take advantage of our diverse capabilities, experience, and careful attention to detail during manufacturing startup through product end-of-life.

View RiverSide electromechanical assembly on Youtube.

RiverSide’s two plants consist of over 132,000 square feet of integrated production and office floor space organized for efficient execution. The Lewiston, Minnesota, headquarters, housing the company’s primary production facility, is approximately 80,000 square feet in size. The second facility, located in Rushford, Minnesota, has approximately 52,000 square feet of available space. Between the two plants, RiverSide is able to offer its Customers a complete product manufacturing package, including product test and quality management.

Surface Mount Technology

  • Fine-pitch
  • BGA (1 mm)
  • µBGA (.4 mm)
  • 01005
  • X-Ray
  • Automated rework
  • Automated optical inspection (AOI)

Lead-through auto-insertion

  • Axial
  • Radial
  • Zierick Terminals
  • DIP

Conformal coating & potting

  • Silicone
  • Polyurethane
  • Acrylic
  • Four-axis robotic platform
  • 19″ x 19″ work area
  • Repeatable to +/- .001 inches
  • Spray heads with 360 degree rotation and tilt angle
  • Dual Dispense System
  • Chain conveyor to handle a heavy load

Low pressure molding technology (hot melt or electro molding)

  • Cavist system
  • 30 to 300 PSI

Electronics “Vault” circuit board enclosure

  • See “Ruggedized Electronics”

Soldering

  • Wave – No-clean & aqueous flux processes
  • Selective Soldering

Comprehensive product test

  • See “Test Capabilities”

Vision based, screen printer
Zierick terminal placement
System integration

  • Box-build
  • Electromechanical Assembly
  • Final product packaging (assembly, documentation & software)
  • Plastic, chassis, cards, cables, harnesses, etc.
  • Ruggedized circuit board enclosure

Serial number tracking

  • Barcode

Fully ESD controlled environment
Technologically capable equipment

ROHS